The stack type semiconductor package module includes a lower semiconductor package having a main substrate, a chip mounted on the main substrate and electrically connected to the main substrate through a wire. An epoxy molding compound (EMC) is provided on the main substrate to cover the chip and the...http://www.google.de/patents/US7462508?utm_source=gb-gplus-sharePatent US7462508 - Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same
