A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a...http://www.google.de/patents/US8154116?utm_source=gb-gplus-sharePatent US8154116 - Layered chip package with heat sink
