Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the...http://www.google.de/patents/US7868440?utm_source=gb-gplus-sharePatent US7868440 - Packaged microdevices and methods for manufacturing packaged microdevices
