A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between...http://www.google.de/patents/US7528007?utm_source=gb-gplus-sharePatent US7528007 - Methods for assembling semiconductor devices and interposers
