A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and...http://www.google.de/patents/US5109317?utm_source=gb-gplus-sharePatent US5109317 - Mounting mechanism for mounting heat sink on multi-chip module
