One or more of stabilizers are disposed on the surface of a semiconductor device or test substrate that includes bond pads or contact pads located at or proximate to a centerline thereof prior to bonding the semiconductor device face-down upon the test substrate. Upon assembly of the semiconductor device...http://www.google.de/patents/US7041513?utm_source=gb-gplus-sharePatent US7041513 - Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates
