An adapter for emulating a ball grid array type package includes a dielectric substrate having an array of holes formed therein. A layer of conductive material is deposited on a bottom surface of the substrate and onto the inner walls of the holes. The bottom surface of the substrate is then selectively...http://www.google.de/patents/USRE36442?utm_source=gb-gplus-sharePatent USRE36442 - Adapter which emulates ball grid array packages
