In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting...http://www.google.de/patents/US7215026?utm_source=gb-gplus-sharePatent US7215026 - Semiconductor module and method of forming a semiconductor module
