The amount of a terminal portion of bonding wire which is melted to form a free air ball for ball bonding and the temperature rise in the bonding wire adjacent the free air ball is limited by quenching of the wire and free air ball with a flow of a gas which also effectively removes heat applied to the...http://www.google.de/patents/US6267290?utm_source=gb-gplus-sharePatent US6267290 - Control of size and heat affected zone for fine pitch wire bonding
