The present invention is directed towards a method and a system of patterning first and second opposed sides of a substrate. The method and system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly....http://www.google.de/patents/US7670529?utm_source=gb-gplus-sharePatent US7670529 - Method and system for double-sided patterning of substrates
