The present invention discloses a multi-chip module packaging device which has outward extension portions of under bump metallurgies (UBM) for satisfying the bonding area requirement during wire bonding operation. Therefore, chips have electrical connections with metal bonding wires welded on the extended...http://www.google.de/patents/US6933616?utm_source=gb-gplus-sharePatent US6933616 - Multi-chip module packaging device using flip-chip bonding technology
