The process of the invention starts with a metal panel, overlying the metal panel is created an interconnect substrate making use of BUM and thin film processing technology while the process of the invention enables the use of stacked vias and merged vias for the connection of the flip chip bumps. The...http://www.google.de/patents/US6562656?utm_source=gb-gplus-sharePatent US6562656 - Cavity down flip chip BGA
