A microelectronic device package and method for manufacture. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first surface to the second surface. A...http://www.google.de/patents/US6819003?utm_source=gb-gplus-sharePatent US6819003 - Recessed encapsulated microelectronic devices and methods for formation
