A multiple integrated circuit (IC) die assembly includes a base IC die and secondary IC dice mounted on a surface of the base IC die. A set of protruding contacts formed on the surface of the base IC die and extending beyond the secondary IC dice link the surface of the base IC die to a printed circuit...http://www.google.de/patents/US6882546?utm_source=gb-gplus-sharePatent US6882546 - Multiple die interconnect system
