A semiconductor device with under bump metallurgy (UBM) and a method for fabricating the semiconductor device are provided, wherein a passivation layer is deposited on a surface of the semiconductor device where a plurality of bond pads are disposed, and formed with a plurality of openings for exposing...http://www.google.de/patents/US7056818?utm_source=gb-gplus-sharePatent US7056818 - Semiconductor device with under bump metallurgy and method for fabricating the same
