To provide a method of fabricating, using thin-film processes only, a 1,600 dpi head with nozzles arranged two-dimensionally on a substrate, e.g., silicon wafer, a drive LSI, thin-film resistors and thin-film conductors are formed on the silicon wafer. Thereafter, ink channels and ...http://www.google.de/patents/US5697144?utm_source=gb-gplus-sharePatent US5697144 - Method of producing a head for the printer
