A resin sealed semiconductor device includes a heat radiation member fixed to a saling resin. The heat radiation member is formed of a clad material including a first metal having a coefficient of linear expansion close to that of the sealing resin, and a second metal laminated on the first metal and...http://www.google.de/patents/US6469380?utm_source=gb-gplus-sharePatent US6469380 - Resin sealed semiconductor device utilizing a clad material heat sink
