A system and method of assembling a ball grid array (BGA) package with IC die support is described. A stiffener is attached to a substrate that includes a centrally located opening with an integrated circuit (IC) die support structure removably held therein. An IC die is mounted to a central region of...http://www.google.de/patents/US20040262754?utm_source=gb-gplus-sharePatent US20040262754 - IC die support structures for ball grid array package fabrication
