The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with...http://www.google.de/patents/US6797626?utm_source=gb-gplus-sharePatent US6797626 - Method of polishing copper layer of substrate
