Composite bond pad structure and geometry increases bond pad density and reduces lift-off problems. Bond pad density is increased by laying out certain non-square bond pads which are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith...http://www.google.de/patents/US5565385?utm_source=gb-gplus-sharePatent US5565385 - Semiconductor bond pad structure and increased bond pad count per die
