An apparatus and method for testing ball grid array integrated circuits (BGA ICs) including a nesting member resiliently supported on a contactor body via guide shafts. The nesting member includes alignment walls and an alignment plate defining chamfered through-holes. The alignment wall is slanted to...http://www.google.de/patents/US5955888?utm_source=gb-gplus-sharePatent US5955888 - Apparatus and method for testing ball grid array packaged integrated circuits
