The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of...http://www.google.de/patents/US5182230?utm_source=gb-gplus-sharePatent US5182230 - Laser methods for circuit repair on integrated circuits and substrates
