A method is proposed for improving the adhesion between a diffusion barrier film and a metal film. Both the diffusion barrier film and the metal film can be deposited in either sequence onto a semiconductor substrate. A substrate comprising a first film, which is one of a diffusion barrier film or a...http://www.google.de/patents/US7465658?utm_source=gb-gplus-sharePatent US7465658 - Oxygen bridge structures and methods to form oxygen bridge structures
