A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by...http://www.google.de/patents/US20070012655?utm_source=gb-gplus-sharePatent US20070012655 - Micro-package, multi-stack micro-package, and manufacturing method therefor
