A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of forming a stressed region in a selected manner at a selected depth (20) underneath the surface. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to...http://www.google.de/patents/US7470600?utm_source=gb-gplus-sharePatent US7470600 - Method and device for controlled cleaving process
