A multilayered wiring board comprising, at least, two wiring layers and an interlaminar insulating layer, in which said wiring board further has, incorporated therein, at least one capacitor element which comprises a sandwiched structure of a lower electrode-forming metallic layer having formed thereon...http://www.google.de/patents/US6410858?utm_source=gb-gplus-sharePatent US6410858 - Multilayered wiring board, a production process for, and semiconductor device using, the same
