A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers ( N >2) and N metal planes formed in the following sequence: dielectric layer 1 on a metallic plane that exists on...http://www.google.de/patents/US20020139578?utm_source=gb-gplus-sharePatent US20020139578 - Hyperbga buildup laminate
