An improved wire bond with the pond pads of semiconductor devices and the lead fingers of lead frames or an improved conductor lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond wherein the bond pad on a surface of the semiconductor device comprises...http://www.google.de/patents/US6544880?utm_source=gb-gplus-sharePatent US6544880 - Method of improving copper interconnects of semiconductor devices for bonding
