A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between...http://www.google.de/patents/US20040079634?utm_source=gb-gplus-sharePatent US20040079634 - Method of forming a sputtering target assembly and assembly made therefrom
