The separation of thin disk-type workpieces from a stack has, as a rule, hitherto been carried out by hand. An apparatus and a corresponding method are now provided which make it possible to lift the wafer off the stack without mechanical contact, and also to convey the separated wafers to the tray and...http://www.google.de/patents/US5213451?utm_source=gb-gplus-sharePatent US5213451 - Apparatus and method of automatically separating stacked wafers
