A method of plating for filling via holes, in which each via hole formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate, is plated with copper, to be filled with the plated metal, the method comprising the steps of forming...http://www.google.de/patents/US20010013472?utm_source=gb-gplus-sharePatent US20010013472 - Method of plating for filling via holes
