A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a bump...http://www.google.de/patents/US7247519?utm_source=gb-gplus-sharePatent US7247519 - Method for making a semiconductor multi-package module having inverted bump chip carrier second package
