An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground...http://www.google.de/patents/US6956285?utm_source=gb-gplus-sharePatent US6956285 - EMI grounding pins for CPU/ASIC chips
