This invention relates to a method for making a thin layer starting from a wafer comprising a front face with a given relief, and a back face, comprising steps consisting of: a) obtaining a support handle with a face acting as a bonding face; b) preparing the front face of the wafer,...http://www.google.de/patents/US20050124138?utm_source=gb-gplus-sharePatent US20050124138 - Method for handling semiconductor layers in such a way as to thin same
