A method for forming a vertical edge submicron through-hole comprises the steps of; forming a hole on a sample thin film with a larger diameter than design size of a through-hole, with a bottom having a thickness close to the design size remaining, by etching using a focused ion beam device; forming...http://www.google.de/patents/US6544897?utm_source=gb-gplus-sharePatent US6544897 - Method for forming a vertical edge submicron through-hole and a thin film sample with this kind of through-hole
