A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is...http://www.google.de/patents/US6451155?utm_source=gb-gplus-sharePatent US6451155 - Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly
