A method for fabricating wafers is provided. A photoresist layer is formed on a wafer. A first thickness of the photoresist layer is measured, and a portion of the photoresist layer is removed. A second thickness of a remainder portion of the photoresist layer is measured. A photoresist strip rate is...http://www.google.de/patents/US6355388?utm_source=gb-gplus-sharePatent US6355388 - Method for controlling photoresist strip processes
