The selection of pH, the polishing slurry, and types of polishing particles within a polishing slurry are chosen, so that polishing product is capable of coating onto the polishing particles. More specifically, the pH of the polishing slurry is selected to be between the iso-electric points of the polishing...http://www.google.de/patents/US5525191?utm_source=gb-gplus-sharePatent US5525191 - Process for polishing a semiconductor substrate
