A method for processing a semiconductor wafer transforms the wafer into one which has a plurality of surface semiconductor platforms for formation of integrated circuit elements thereupon. The platforms are connected to a subsurface bulk layer of semiconductor material via integrally-formed bridges of...http://www.google.de/patents/US6245636?utm_source=gb-gplus-sharePatent US6245636 - Method of formation of pseudo-SOI structures with direct contact of transistor body to the substrate
