A silicon wafer is provided having a polished front surface with an epitaxial coating and a polished back surface, which is distinguished by a SFQRmax value of less than or equal to 0.10 m (26 mm8 mm; 99%). There is also a process for producing silicon wafers of this type by sawing up a single crystal,...http://www.google.de/patents/US20030041798?utm_source=gb-gplus-sharePatent US20030041798 - Coated silicon wafer and process for its production
