A high performance single package multi-chip module multiplies the logic density of the highest density monolithic programmable logic device (PLD). A dual-sided substrate carries multiple prepackaged PLDs on a top side and a field programmable interconnect (FPIC) die on a bottom side. The prepackaged...http://www.google.de/patents/US6642064?utm_source=gb-gplus-sharePatent US6642064 - Method of making a high density programmable logic device in a multichip module package
