A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump. The decoupling capacitor has Vcc and Vss terminals....http://www.google.de/patents/US7135758?utm_source=gb-gplus-sharePatent US7135758 - Surface mount solder method and apparatus for decoupling capacitance and process of making
