Method and apparatus for chemically, mechanically and/or electrolytically removing material from microelectronic substrates. A polishing medium for removing material can include a liquid carrier, an electrolyte disposed in the liquid carrier, and abrasives disposed in the liquid carrier, with the abrasives...http://www.google.de/patents/US7192335?utm_source=gb-gplus-sharePatent US7192335 - Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
