A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first edge, and an engaging surface with at least a portion of the engaging surface spaced apart from the first...http://www.google.de/patents/US6365434?utm_source=gb-gplus-sharePatent US6365434 - Method and apparatus for reduced flash encapsulation of microelectronic devices
