An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the...http://www.google.de/patents/US7140883?utm_source=gb-gplus-sharePatent US7140883 - Contact carriers (tiles) for populating larger substrates with spring contacts
