An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein....http://www.google.de/patents/US5889232?utm_source=gb-gplus-sharePatent US5889232 - Ultrahigh-frequency electronic component
