Embodiments of methods in accordance with the present invention provide a planarized surface between a semiconductor device and a portion of surrounding passivation material. The methods involve the use of a hard mask that defines the planarized surface as the interface between the hard mask and both...http://www.google.de/patents/US6987068?utm_source=gb-gplus-sharePatent US6987068 - Methods to planarize semiconductor device and passivation layer
