A method for fabricating a connector structure for interconnecting integrated circuit chips. The method includes the steps of patterning, masking and etching a substrate to form protrusions on the top and/or bottom surfaces of the substrate. Then the protrusions are preferentially etched to form truncated...http://www.google.de/patents/US6271059?utm_source=gb-gplus-sharePatent US6271059 - Chip interconnection structure using stub terminals
