Partial photoresist etching is disclosed. A film on a semiconductor wafer includes a hard mask, doped polysilicon below the hard mask, undoped polysilicon below the doped polysilicon, and a stop layer below the undoped polysilicon. Photoresist etching is performed through the hard mask and the doped...http://www.google.de/patents/US6686129?utm_source=gb-gplus-sharePatent US6686129 - Partial photoresist etching
