An electronic assembly is assembled by stacking two or more integrated circuit dies on top of one another. Prior to singulation, an opening is laser-drilled into an upper die, and subsequently filled with a conductive member. The conductive member is located on a lower die and interconnects integrated...http://www.google.de/patents/US20050090042?utm_source=gb-gplus-sharePatent US20050090042 - Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
